It is the final step where the wafer is sorted again by the thickness and other defect levels before sending back to the market. Troubleshooting equipment is used to perform the inspection.
Our expertise in Silicon goes back to 1990. Our process engineers have been at the forefront of Silicon wafer production in virtually every step of the process, including such areas as Silicon crystal growth, slicing, lapping, stepped-polishing, single side polish, double-side polish, edge grind/shape, etching, cleaning, QA-inspections, process engineering and development, polishing plant design/production, special tool manufacturing, training, and packaging. We are highly skilled in all diameters of Silicon wafers from 50mm to 300mm.